GaN-on-SiC transistors for S-band radar

Integra Technologies, the RF and microwave transistor and amplifier specialist, has announced a pair of 135 W and a 130 W GaN-on-SiC transistors for S-band radar applications.

IGT2731M130 is a 50-Ohm matched high-power GaN HEMT transistor, suppling a minimum of 130 W of peak pulsed power, a gain of 13.5 dB and a drain efficiency of 55%, at pulse conditions of 300 microseconds/10% duty cycle. It operates at the instantaneous operating frequency range of 2.7 to 3.1 GHz, and is a depletion mode device. It requires a negative gate bias voltage and bias sequencing.

IGT3135M135 operates at the instantaneous operating frequency range of 3.1 to 3.5 GHz, supplying up to 135 W of peak pulsed power. This transistor is also a 50-Ohm matched high-power GaN HEMT transistor and is also a depletion-mode device that requires a negative gate bias voltage and bias sequencing.

Both products come in Integra’s package PL44A1, size is at 0.800 in. (20.32 mm) wide and 0.400 in. (10.16 mm) long. Earless, they are 0.400 in. (10.16 mm) wide and 0.400 in. (10.16 mm) long. Assembled via chip and wire technology, utilizing gold metallization, both units are housed in a metal-based package and sealed with a ceramic-epoxy lid.

Link: http://www.tenco-tech.com/news/IC/electronic-component-33.html

Source from: Electronics weekly

Mouser to sponsor NXP Cup for autonomous vehicles

Mouser will be the lead distribution sponsor for the NXP Cup, a global competition where student teams build, program, and race model cars around a track.

The EMEA finals of the NXP Cup will take place at the Fraunhofer Institute for Integrated Circuits (IIS) in Erlangen, Germany.

The NXP Cup challenges student teams from around the world to build an intelligent car that can speed around a standardised track.

The fastest car to complete the track without derailing wins the race. To create the autonomous car, students build basic circuits and program embedded software using NXP parts included in the entry kit.

Students then create motor control hardware and software to propel and steer their intelligent cars and must also incorporate a camera and interface in order to navigate the cars through the track by following a guide line.

“Students must demonstrate real innovation for a future reality where driverless vehicles are the norm,” says Mouser’s Mark Patrick, “this requires a thorough understanding of IoT platforms, hardware and software and sensor technologies. We are delighted to assist one of our key franchise partners, NXP, with this event and be the headline sponsor, and we wish all the qualifying teams the best of luck in the final”.

Link: http://www.tenco-tech.com/news/IC/electronic-component-32.html

Source from: Electronics weekly

Step-up µModule regulator in a 6.25mm x 6.25mm x 2.42mm BGA package

The Power by Linear LTM4661 is a low power step-up µModule regulator in a 6.25mm x 6.25mm x 2.42mm BGA package.

Only a few capacitors and one resistor are required to complete the design, and the solution occupies less than 1cm² single-sided or 0.5cm² on double-sided PCBs.

The LTM4661 incorporates a switching DC/DC controller, MOSFETs, inductors and supporting components.

The Chip operates from a 1.8V to 5.5V input supply, and continues to operate down to 0.7V after start-up. The output voltage can be set by a single resistor ranging from 2.5V to 15V.

The combination of the small, thin package and wide input and output voltage range is ideal for a wide range of applications including optical modules, battery-powered equipment, battery-based backup systems, bias voltage for power amps or laser diodes and small DC motors.

The device can deliver 4A continuously under 3.3VIN to 5VOUT, and 0.7A continuously under 3.3VIN to 12VOUT. The LTM4661 employs synchronous rectification, which delivers as high as 92% conversion efficiency (3.3VIN to 5VOUT).

The switching frequency is 1MHz, and can also be synchronized to an external clock ranging from 500kHz to 1.5MHz. The 1MHz switching frequency and dual phase single output architecture enable fast transient response to line and load changes and a significant reduction of output ripple voltage.

The chip has three operation modes: Burst Mode operation, forced continuous mode and external sync mode. The quiescent current in Burst Mode operation is only 25µA, which provides extended battery run time. For applications demanding the lowest possible noise operation, the forced continuous mode or external sync mode minimize possible interference of switching noise.

It has  an output disconnect during shutdown and inrush current limit at startup.

Link: http://www.tenco-tech.com/news/IC/electronic-component-31.html

Source from: Electronics weekly

KEMET expands ceramic capacitor series

KEMET  has expanded its ESD rated ceramic capacitor series into a complete product portfolio.

Automotive and commercial grades are now available in EIA 0402, 0603, 0805 and 1206 case sizes with voltage ratings of 16 to 250 VDC.

These devices provide miniaturization and enhanced flexibility to optimize ESD suppression, RF filtering, blocking, sensing, and circuit protection.

The product portfolio offers additional case sizes, voltage ranges, capacitance values and ESD ratings with more options for a wider variety of customer applications.

Design engineers can choose either X7R or C0G dielectric for circuits requiring Class-II or Class-I stability and noise performance with the ability to design to given ESD criteria per the Human Body Model (HBM) AEC-Q200-002.

ESD events  are estimated to reduce assembly-line productivity by up to 33%.

KEMET’s ESD rated capacitors enhance circuit protection of integrated circuits, and smaller dimensions simplify designs while minimizing impact on overall form factor.

Link: http://www.tenco-tech.com/news/IC/electronic-component-29.html

Source from: electronics weekly

Intel sells Wind River to TPG

Intel has sold its IoT software subsidiary Wind River to private equity outfit TPG.

Wind River President, Jim Douglas, and his existing executive management team will lead the newly independent Wind River after the transaction closes.

“Our technology team is focused on backing strong, market-leading companies in growing industries,” said Nehal Raj, Partner and Head of Technology investing at TPG. “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

For nearly 40 years, Wind River has helped the world’s technology leaders power generation after generation of the safest, most secure devices in the world. The company’s software runs the computing systems of the most important modern infrastructure, including manufacturing plants, medical devices, aircraft, railway, automobiles, and communications networks. Wind River’s products and solutions enable engineers, developers, manufacturers, and system integrators to build intelligent connected devices, sensors, gateways, and networks that unlock machine data and connect it to cloud and IT environments.

“This acquisition will establish Wind River as a leading independent software provider uniquely positioned to advance digital transformation within critical infrastructure segments with our comprehensive edge to cloud portfolio,” said Jim Douglas, Wind River President. “At the same time, TPG will provide Wind River with the flexibility and financial resources to fuel our many growth opportunities as a standalone software company that enables the deployment of safe, secure, and reliable intelligent systems.”

“This move is designed to sharpen our focus on growth opportuniti that align to Intel’s data-centric strategy,” said Tom Lantzsch, senior vice president and general manager of the Internet of Things Group at Intel. “Wind River will remain an important ecosystem partner, and we will continue to collaborate on critical software-defined infrastructure opportunities to advance an autonomous future. We expect this transition will be seamless for our mutual customers and partners.”

Link: http://www.tenco-tech.com/news/IC/electronic-component-28.html

Source from: Electronics weekly

Samsung commits to AI R&D in France

Young Sohn, former CEO of Inphi, now Chief Strategy Officer at Samsung, pitches a proposal to the President of France, Emmanuel Macron, at the Elysee Palace.

Young Sohn, former CEO of Inphi, now Chief Strategy Officer at Samsung, pitches a proposal to the President of France, Emmanuel Macron, at the Elysee Palace.

Sohn is reported to have undertaken to make France Samsung’s third main location for AI R&D after Korea and California.

Sohn is said to have undertaken to base 100 AI researchers in France.

Samsung’s French AI R&D effort will be headed up by Luc Julia, a Frenchman, who invented Apple’s Siri.

Link: http://www.tenco-tech.com/news/IC/electronic-component-27.html

Source from: electronics weekly

Ultrahaptics launches STRATOS development kit

Ultrahaptics, the haptic touch specialist, has  launched STRATOS Explore, the first development kit based on its new STRATOS platform. STRATOS Explore is available to buy through Ultrahaptics’ worldwide distribution network.

Ultrahaptics’ core mid-air haptic technology creates the sense of touch in mid-air by using arrays of ultrasonic transducers to project haptic feedback directly onto users’ hands.

STRATOS Explore has been created for developers who want to build applications requiring sophisticated mid-air haptic sensations, such as virtual reality, 3D gesture interfaces and advanced automotive controls.

The STRATOS platform’s faster refresh rate and precision control of ultrasound waves creates the ability to render complex shapes such as 3D objects.

Ultrahaptics’ technology controls the emission of ultrasound waves and manipulates them so that the combined pressure of the waves interacting produces enough force to be felt on a user’s skin.

When multiple pressure points are created, the user can feel 3D shapes, buttons, sliders and virtual objects in thin air.

The company has publicly demonstrated its technology in applications including augmented and virtual reality, digital signage and location-based entertainment, often in collaboration with worldwide brands such as Dell, Nike, Meta and Pagani.

It has also licensed its technology to third parties: BOSCH and Harman have used mid-air haptics to create concept vehicle interfaces that have been showcased around the world.

VP Sales, David Hearne, commented on the launch of the development kit, saying, “The STRATOS Explore development kit is the best solution for customers who want to explore how mid-air haptics can enhance their products. We can now offer an off-the-shelf development kit based on our most advanced platform. Whether customers are looking to create cutting-edge, cleaner and safer user interfaces, or to design immersive experiences in which users can reach out and touch 3D digital media, we now have the perfect tool for them to start innovating with.”

The STRATOS Explore development kit is available to buy from Ultrahaptics’ worldwide distribution network.

Link: http://www.tenco-tech.com/news/IC/electronic-component-26.html

Source from: electronics weekly