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ROHM's Blu-Brite Semiconductor has developed the world's smallest wireless power chipset "ML7630 (receiver)" and "ML7631 (transmitter)"

ROHM Group's Blue Bishi Semiconductor Co., Ltd. (hereinafter referred to as "BLK Semiconductor") develops the world's smallest wireless power supply control chipset "ML7630 (receiver/terminal)" and "ML7631 (transmission terminal)" for wearable devices. / Charger side)".

This chipset is a wireless power supply control LSI that is suitable for wireless power supply of smart ear-mounted devices*1 such as Bluetooth® headsets that have space limitations in wearable devices. In order to support applications in smart ear-worn devices, Lanbishi Semiconductor miniaturizes the antenna (coil) by performing power transmission at a high frequency of 13.56 MHz, and integrates the functions required for charging into one chip, making It is used as a SoC*2 (system-on-chip), which greatly reduces the installation space (50% compared to the area of ​​the MicroUSB connector). The wireless power supply of smart ear-worn devices, which was difficult to achieve in the past, not only contributes to the miniaturization of the devices, but also helps to improve the convenience of charging, the waterproofness, and the dustproofness.

Even if the battery is exhausted, the receiver's “ML7630” can use the antenna magnetic field to generate electricity and start working. In addition, although it is a small WL-CSP package that is only 2.6mm square, it achieves wireless power supply with output power up to 200mW. Not only that, but also to meet the NFC Forum Type3 Tag v1.0 ※ 3 specification, support Bluetooth® pairing and other functions based on NFC touch. Moreover, the transmitter's "ML7631" can work with 5V power provided by a USB power source such as a mobile phone battery, which is very beneficial to the development of mobile chargers.
The chipset has already begun selling samples, and production is expected to start in May 2018. The production base of the previous process was Rinpoche Semiconductor Miyagi Co., Ltd. (Miyagi Prefecture), the production base of the later process, “ML7630”, was Blue Pitt Semiconductors Miyazaki Co., Ltd. (Miyazaki Prefecture), and “ML7631” was ROHM Integrated Systems. (Thailand) Co., Ltd.
In the future, Lanbishi Semiconductor will continue to develop wireless power supply products and provide solutions for small electronic devices, contributing to the intelligent development of the society.

<background>
In recent years, the "smart ear-bearing device" worn on the ear has attracted attention as a new generation of wearable devices. However, due to the ultra-compact size of the smart ear-mounted device, terminals for power supply such as the Micro USB connector have become a problem of miniaturization and further space saving.
In this context, wireless power supply can eliminate the need for terminals, which will greatly facilitate the miniaturization of the device. In addition, there is no terminal can also improve the waterproof performance, dust resistance and other safety features, is very effective power supply system for ultra-small devices.
ROHM Group has been developing and supplying products that meet the wireless power supply standards (WPC Qi, etc.) for terminals such as smartphones and tablet PCs. As a major member of the NFC Forum, a member of the ROHM Group, LAPIS Semiconductor has been actively participating in the development of a 13.56MHz wireless power supply standard for wearable devices that require ultra-small wireless power systems.

<New Product Features>
1. Wireless power supply saves space in the power supply department
By using the 13.56MHz band wireless power supply, the chipset can use a small antenna of about 1μH, which is very helpful for the wireless power supply of wearable devices such as smart ear-worn devices, and the terminal-less configuration is beneficial to the device. Further miniaturization. For example, using an ultra-small antenna (such as the MNA4040 manufactured by MARUWA Co., Ltd.) can reduce the area by 50% (the area ratio calculated by the company) compared with the area occupied by the power supply unit using the MicroUSB connector.
2. No microcontroller, more space-saving, no need to develop software to build the system
The "ML7630" and "ML7631" integrate the functions required for power transmission and reception into one chip, enabling wireless power control without a microcontroller. Therefore, not only does software development not be required, but it also contributes to further miniaturization by saving microcontroller mounting space. You can use a dedicated PC tool to customize the charge voltage level and recharge.
3. Feature-rich support for smart ear-wearing devices
①The battery can start working without power
The receiver's "ML7630" can use the magnetic field generated by the antenna to supply power, so even if the battery is exhausted it can start working.

②200mW Output LDO and Temperature Management Charge Li-Ion Battery
The "ML7630" has a built-in LDO that can output 200mW. A charging IC is used at this output to charge the lithium-ion battery. In addition, with the built-in 10-bit AD converter and comparator, temperature management (temperature detection, threshold management), which is very important for lithium-ion batteries, can be implemented programmatically, enabling reliable charge control.

③ Meet the NFC Forum Type 3 Tag specification
The "ML7630" supports the NFC Forum Type3 Tag v1.0 specification, which reads Tag information written in the Flash ROM in the "ML7630" from devices such as smartphones that use NFC technology, and therefore supports NFC without screen operation or switching operations. Touch functions such as Bluetooth® pairing.
The
[Application area]
Wearable devices, smart ear wearing devices
<terms commentary>
※1:Hearable
Wearable devices worn on the ear, including wireless headsets and wireless in-ear headphones. In recent years, the pace of high performance has been rapidly growing in sync with smartphones.
※2: SoC (System on a Chip, System-on-a-chip, System-on-Chip)
Generally refers to an IC that integrates functions required for system operation. Here is the integration of wireless power, charging, temperature management and other functions into one chip.
※3: NFC Forum Type3 Tag v1.0
NFC (Near Field Communication) refers to a near field communication technology that communicates at a proper distance using a frequency of 13.56 MHz, and specification specifications are defined by the NFC Forum. Type3 is one of its specifications.

More consultation：Tenco-tech

Amazon is working on another big bet - home robot

Ten years ago, e-commerce giant Amazon introduced the Kindle, an e-book reader, and established the appeal of reading on digital devices. Four years ago, Jeff Bezos and his company launched the smart speaker Echo, prompting millions of people to start talking to computers. Now, Amazon is working on another big bet - home robots.

According to informed sources, the retail and cloud computing giant has embarked on an ambitious top secret plan to create a new category of products, namely home robots. This project is code-named "Vesta" and its name derives from stoves and family goddesses in Roman mythology. The project was led by Gregg Zehr, head of Amazon's Lab126 hardware R&D department at Sunnyvale, California. Lab126 is responsible for Amazon's device development efforts, such as the Echo smart speakers, Fire TV set-top boxes, Fire Tablet PCs and the ill-fated Fire Phone.

The "Vesta" project began a few years ago, but this year, Amazon began to increase recruiting personnel. On the recruitment page of Lab126, there are dozens of job vacancies, such as “software engineers”, “robot technicians” and “principal sensor engineers”. People familiar with the plan said that Amazon hopes to start deploying robots in its employees' homes before the end of this year, and it may sell them to consumers as early as 2019. However, this schedule may change, and Amazon's hardware projects are sometimes killed during the brewing.

A spokesman for Amazon said that the company does not comment on "rumors and speculation."

It is not yet clear what tasks Amazon can perform. People familiar with the project speculated that the "Vesta" robot may be Alexa, a mobile intelligence assistant who accompanied the owner without a smart speaker Echo at home. The prototype of the robot has advanced camera and computer vision software that can be navigated home like a driverless car. Former executive Apple Max Paley is responsible for computer vision work. Amazon also hired a professional mechanical engineer in the robotics industry.

According to informed sources, the "Vesta" project is different from the one designed by Amazon Robotics, a subsidiary of Amazon and Massachusetts. Amazon Robotics deployed robots in Amazon's warehouse to transfer goods. It was established after Amazon bought Kiva Systems, a robot company, for $775 million in 2012.

For decades, the prospect of home-based robots providing companionship or basic housework has made the industry very attractive. Atari's founder, Nolan Bushnell, introduced a Topo robot with a nearly 1-meter high, snowman shape in 1983. Although it can be pre-transformed and uses Apple II computer control, it has almost no other features and sales are poor.

In the following years, the United States, Japan, and China began to try to create useful "robot servants," and their performance is getting better and better. iRobot's Roomba can only do one thing, that is, vacuuming, it is a leader in the field. Since 2002, this robot has sold more than 20 million units. iRobot shares fell 8.6% on Monday, the biggest intraday drop since early February.

Recently, Sony and LG Electronics have also become interested in home robots. At the CES show in January this year, LG showed a robot named Cloi, but failed repeatedly in the demonstration. Sony revealed a new version of the robot dog, Aibo, which was first introduced 20 years ago. In addition to howling (Although Aibo has been set to play football), it is not very useful. This dog sells for 1,800 US dollars, which is equivalent to the cost of keeping a real dog.

Advances in computer vision technology, cameras, artificial intelligence, and voice activation technologies have enabled Amazon to bring robots to market. The retail giant has already indicated that it is willing to provide a partial subsidy to Prime members who purchase more products and subscribe through its product subscription service, which will also make it more affordable for mainstream consumers in the future.

Other electronic products

XMC mezzanine card delivers up to 16 cores Intel Xeon D processors

KONTRON XMC-GPU91 XMC mezzanine card features the latest AMD Embedded Radeon E9171 power-efficient GPU. Product supports the PCI Express 3.0 interface for higher data throughputs and features 12mm stacking height for better temperature and cooling. Device is intended to combine with an off-the-shelf SBC to form a high-performance SBC-/GPGPU combination in the 1” pitch standard VITA VPX form factor. Product takes full benefit of the PCI Express 3.0 architecture provided on firm’s latest family of blade computers, including up to 16 cores Intel Xeon D processors.

more：TENCO

Six major problems encountered by LED chips

Forward voltage reduction and dark light
(1) one is the ohmic contact between the electrode and the luminescent material, but the contact resistance is large, which is mainly caused by the low concentration of the substrate or the defect of the electrode.

(2) one is the non ohm contact between the electrode and the material, which mainly occurs when the first layer of electrode is evaporated during the preparation of the chip electrode.

In addition, the forward pressure reduction may be caused in the encapsulation process, mainly due to the insufficient curing of the silver glue, the contamination of the support or the chip electrode, and the instability of contact resistance or contact resistance.

When the chip is tested on a fixed voltage, the chip has a small current, which shows a dark point, and a dark light phenomenon is that the chip itself has low luminous efficiency and normal pressure drop.

Hard pressure welding
(1) no sticking: mainly due to oxidation or glue on the electrode surface.

(2) contact with the luminescent material is not tight and the thickness of the welding layer is not strong, especially the thickening layer.

(3) wear electrode: usually related to chip material, material brittle and not high strength material easily wear electrode, general GAALAS material (such as high red, infrared chip) is easier to wear than the GAP material.

(4) pressure welding should be adjusted from welding temperature, ultrasonic power, ultrasonic time, pressure, gold ball size and bracket positioning.

Color difference of luminescence
(1) the obvious difference in the color of the same chip is mainly due to the problem of the epitaxial sheet material. The ALGAINP four element material is very thin with quantum structure, and it is difficult to ensure the consistency of the components in each region. The composition determines the forbidden band width and the wavelength of the forbidden band determines the wavelength.

(2) GAP yellow green chip, the luminous wavelength will not be greatly deviate, but because the human eye is sensitive to the color of the band, it is easy to detect yellowish and greenish. Because the wavelength is determined by the epitaxial material, the smaller the area is, the smaller the color deviation concept is. So there is a neighbor selection method in the M/T operation.

(3) some of the red chips of GAP are light orange yellow because of their indirect mechanism. Due to the influence of impurity concentration, when the current density increases, impurity level shifts and luminescence saturation are easily produced, and the luminescence starts to turn orange yellow.

Sluice effect
(1) the LED is unable to conduct at normal voltage, and when the voltage increases to a certain extent, the current changes.

(2) the reason of the phenomenon of brake fluid is that the reverse interlayer appears when the epitaxial piece of the luminescent material is grown. The positive pressure drop of the LED at IF=20MA is hidden. In the process of use, the voltage of the two poles is not big enough and the performance is not bright. The test information instrument can be used to test the curve from the crystal tube diagram, and can also pass through the small curve. The forward voltage drop under current IF=10UA shows that the forward voltage drop under a small current is obviously too large, which may be caused by this problem.

Reverse leakage current IR
Under the limited condition, the reverse leakage current is the basic characteristic of the diode. According to the conventional regulation of LED, it refers to the reverse leakage current of the reverse voltage at 5V. With the improvement of the performance of the LED, the reverse leakage current will be smaller and smaller. IR the smaller the better, the reason is the irregular movement of electrons.
(1) the reason for the quality of the chip itself may be caused by the abnormal cutting of the chip itself.

(2) too much silver glue point, which can cause short circuit when serious. The reverse leakage caused by the epitaxy is mainly caused by the internal structure defects of PN junction. The side corrosion of the chip is not enough or the silvery silk is attached to the surface, and the organic solution is strictly prohibited. To prevent the silver gum from crawling through the capillary phenomenon to the knot area.

(3) electrostatic injury. Epitaxial materials, chip fabrication, device encapsulation, general 5V reverse leakage current is 10UA, and reverse voltage can be fixed under reverse current.  The reverse characteristics of different types of LED are large: common green, reverse yellow yellow chips can reach more than 100 volts, and common red chips are between ten and twenty volts.

(4) improper welding line pressure leads to increased IR in the wafer.

Solution：
(1) the amount of silver colloid should be controlled at 1/3 to 1/2 of wafer height.

(2) the static volume of the human body and the machine should be controlled below 50V.

(3) the pressure at the first point of the welding line should be controlled between 30 and 45g.

Dead light phenomenon
(1) the leakage of LED leads to the failure of PN junction and makes the LED lamp not lit. This situation will not affect the work of other LED lamps in general.

(2) the internal connection wire of the LED lamp is disconnected, causing the dead light to produce LED without current. This situation will affect the normal work of other LED lights because of the low working voltage of the LED lamp (red yellow orange LED working voltage 1.8v-2.2v, blue green white LED working voltage 2.8-3.2v), all of which are connected in series and parallel in parallel to adapt to the difference. The work voltage, the more LED lights in series, the greater the impact, as long as there is one of the LED lights inside the line, the whole series of LED lights will not be bright, this situation is more serious than the first situation.

tenco-tech provides wich you

The code is also Zen! AMD graphics card comeback: soaring frequency

AMD Ryzen processor kills the Quartet, unlimited scenery, forcing Intel to have to fully accelerate, but on the other hand, AMD graphics card is in awkward position, can not afford a competitive product.

As a result, NVIDIA has made it easier to enter the emerging fields of artificial intelligence, unmanned driving, etc., and it is still in the hands of the graphics card market. It even came up with the GPP's "malicious" project that excludes its adversaries.

So, where is the future of AMD graphics cards?

Raja Koduri, the boss of AMD's RTG graphics technology division, has resigned to Intel, but in fact AMD has already prepared.

According to the news, around the middle of last October, AMD CEO Dr. Lisa Su began to reorganize the RTG Business Unit. On the one hand, he hired David Wang and Mike Rayfiled, both of whom were in the graphics industry, to take charge of the technical development and daily operations of the entire business division. Large-scale restructuring was carried out.

And this time, Dr. Lisa Su will personally direct the entire graphics team.

Given that the current road map cannot meet the competition needs, AMD has set up a new GPU R&D team. Specifically, it has transferred a lot of engineers from the Zen CPU R&D team and started to develop a new architecture. It is said that it will completely leave the GCN architecture that has been used for many years.

The new architecture focuses on two aspects. One is to significantly increase the frequency to bring high performance, and the second is to reduce power consumption and improve energy efficiency.

The new project has not yet been named, but insiders call it "Project Zen," and it seems that it is like Zen CPU to be as successful as once again.

But since it is a brand-new product, it will take time. Maybe it will be 2019 or even 2020. Of course, the process will definitely be 7nm.

Source from: TENCO

CAP-XX launches thin 3V supercapacitors

CAP-XX has announced the development of 3V thin prismatic supercapacitors, aiming them at wearables, key fobs and other IoT devices where high instantaneous current peaks are needed. Compared with the firm’s existing 2.7V devices, 3V operation allows direct connection to a 3V coin cell, rather than needing an intervening 2.7V LDO.

“CAP-XX is initially targeting markets using 3V coin cell batteries, where popular batteries such as the CR2032 have reasonable energy, ~220mAh, but have trouble delivering the ~100mA needed for data collection and transmission,” said the firm.

The capacitors will range from 0.9 to 1.9mm thick and come in the same footprints as the firm’s existing 2.7V thin prismatic supercapacitors: 20 x 15mm, 20 x 18mm, 17.5 x 28.5mm and 17.5 x 39.5mm.

Initial samples, expected by the end of August, will be in the larger package. Other footprints will follow, as will 0.6mm ‘Thinline’ products.

Leakage current is expected to be approximately 1.5µA for a 500mF cell at 3V, reducing to ~ 0.7µA at 2.5V.

Prototypes have been tested at 3V 70°C and meet the IEC 62391 endurance requirement.

To achieve the 3V operation, the firm developed new materials and production techniques.

Mass production scheduled for the first half of 2019, and larger 3V prismatic supercapacitors and 3V automotive modules are planned.

CAP-XX CEO Anthony Kongats covered the 3V supercaps in the paper ‘Using thin prismatic supercapacitors to support 3V coin cell batteries’, which he presented today at IDTechEx in Berlin.

Keyword: electronic

Source from: electronics weekly

Dell and Fujitsu to use Intel FPGAs in servers

“We are beginning our adoption of Intel Programmable Acceleration Card with Arria 10 GX FPGA with PRIMERGY server and engaging our priority customers,” says Fujitsu’s Kenichi Saka.

Dell EMC PowerEdge R640, R740 and R740XD servers incorporating Intel FPGA acceleration are now available for volume deployment.

This PCIe-based FPGA accelerator card for data centers offers both inline and lookaside acceleration.

This acceleration stack provides a common developer interface for both application and accelerator function developers, and includes drivers, application programming interfaces (APIs), and an FPGA interface manager.

Together with acceleration libraries and development tools, the acceleration stack saves developers time and enables code re-use across multiple Intel FPGA platforms.

The card can be deployed in a variety of servers used in big data analytics, AI, genomics, video transcoding, cybersecurity, and financial trading.

Link: http://www.tenco-tech.com/news/IC/electronic-component-35.html

Source from: Electronics weekly

Raspberry Pi gets IP40 protection from Phoenix Contact

Phoenix Contact has introduced a housing for Raspberry Pi minicomputers which are designed to provide Raspberry Pi B2 and B3 models with mechanical and physical protection.

The UCS-RPI series of light grey or black housings offer IP40 degree of protection are available in the sizes 125 mm x 87 mm and 145 mm x 125 mm.

The inter-compatible side panels of the electronics housings are factory-equipped with knockouts for standard Raspberry Pi module connections.

With mounting accessories these housings are suitable for use on desks, walls, or DIN rails.

Link: http://www.tenco-tech.com/news/IC/electronic-component-34.html

Source from: Electronics weekly

GaN-on-SiC transistors for S-band radar

Integra Technologies, the RF and microwave transistor and amplifier specialist, has announced a pair of 135 W and a 130 W GaN-on-SiC transistors for S-band radar applications.

IGT2731M130 is a 50-Ohm matched high-power GaN HEMT transistor, suppling a minimum of 130 W of peak pulsed power, a gain of 13.5 dB and a drain efficiency of 55%, at pulse conditions of 300 microseconds/10% duty cycle. It operates at the instantaneous operating frequency range of 2.7 to 3.1 GHz, and is a depletion mode device. It requires a negative gate bias voltage and bias sequencing.

IGT3135M135 operates at the instantaneous operating frequency range of 3.1 to 3.5 GHz, supplying up to 135 W of peak pulsed power. This transistor is also a 50-Ohm matched high-power GaN HEMT transistor and is also a depletion-mode device that requires a negative gate bias voltage and bias sequencing.

Both products come in Integra’s package PL44A1, size is at 0.800 in. (20.32 mm) wide and 0.400 in. (10.16 mm) long. Earless, they are 0.400 in. (10.16 mm) wide and 0.400 in. (10.16 mm) long. Assembled via chip and wire technology, utilizing gold metallization, both units are housed in a metal-based package and sealed with a ceramic-epoxy lid.

Link: http://www.tenco-tech.com/news/IC/electronic-component-33.html

Source from: Electronics weekly

Mouser to sponsor NXP Cup for autonomous vehicles

Mouser will be the lead distribution sponsor for the NXP Cup, a global competition where student teams build, program, and race model cars around a track.

The EMEA finals of the NXP Cup will take place at the Fraunhofer Institute for Integrated Circuits (IIS) in Erlangen, Germany.

The NXP Cup challenges student teams from around the world to build an intelligent car that can speed around a standardised track.

The fastest car to complete the track without derailing wins the race. To create the autonomous car, students build basic circuits and program embedded software using NXP parts included in the entry kit.

Students then create motor control hardware and software to propel and steer their intelligent cars and must also incorporate a camera and interface in order to navigate the cars through the track by following a guide line.

“Students must demonstrate real innovation for a future reality where driverless vehicles are the norm,” says Mouser’s Mark Patrick, “this requires a thorough understanding of IoT platforms, hardware and software and sensor technologies. We are delighted to assist one of our key franchise partners, NXP, with this event and be the headline sponsor, and we wish all the qualifying teams the best of luck in the final”.

Link: http://www.tenco-tech.com/news/IC/electronic-component-32.html

Source from: Electronics weekly

Step-up µModule regulator in a 6.25mm x 6.25mm x 2.42mm BGA package

The Power by Linear LTM4661 is a low power step-up µModule regulator in a 6.25mm x 6.25mm x 2.42mm BGA package.

Only a few capacitors and one resistor are required to complete the design, and the solution occupies less than 1cm² single-sided or 0.5cm² on double-sided PCBs.

The LTM4661 incorporates a switching DC/DC controller, MOSFETs, inductors and supporting components.

The Chip operates from a 1.8V to 5.5V input supply, and continues to operate down to 0.7V after start-up. The output voltage can be set by a single resistor ranging from 2.5V to 15V.

The combination of the small, thin package and wide input and output voltage range is ideal for a wide range of applications including optical modules, battery-powered equipment, battery-based backup systems, bias voltage for power amps or laser diodes and small DC motors.

The device can deliver 4A continuously under 3.3VIN to 5VOUT, and 0.7A continuously under 3.3VIN to 12VOUT. The LTM4661 employs synchronous rectification, which delivers as high as 92% conversion efficiency (3.3VIN to 5VOUT).

The switching frequency is 1MHz, and can also be synchronized to an external clock ranging from 500kHz to 1.5MHz. The 1MHz switching frequency and dual phase single output architecture enable fast transient response to line and load changes and a significant reduction of output ripple voltage.

The chip has three operation modes: Burst Mode operation, forced continuous mode and external sync mode. The quiescent current in Burst Mode operation is only 25µA, which provides extended battery run time. For applications demanding the lowest possible noise operation, the forced continuous mode or external sync mode minimize possible interference of switching noise.

It has  an output disconnect during shutdown and inrush current limit at startup.

Link: http://www.tenco-tech.com/news/IC/electronic-component-31.html

Source from: Electronics weekly

KEMET expands ceramic capacitor series

KEMET  has expanded its ESD rated ceramic capacitor series into a complete product portfolio.

Automotive and commercial grades are now available in EIA 0402, 0603, 0805 and 1206 case sizes with voltage ratings of 16 to 250 VDC.

These devices provide miniaturization and enhanced flexibility to optimize ESD suppression, RF filtering, blocking, sensing, and circuit protection.

The product portfolio offers additional case sizes, voltage ranges, capacitance values and ESD ratings with more options for a wider variety of customer applications.

Design engineers can choose either X7R or C0G dielectric for circuits requiring Class-II or Class-I stability and noise performance with the ability to design to given ESD criteria per the Human Body Model (HBM) AEC-Q200-002.

ESD events  are estimated to reduce assembly-line productivity by up to 33%.

KEMET’s ESD rated capacitors enhance circuit protection of integrated circuits, and smaller dimensions simplify designs while minimizing impact on overall form factor.

Link: http://www.tenco-tech.com/news/IC/electronic-component-29.html

Source from: electronics weekly

Intel sells Wind River to TPG

Intel has sold its IoT software subsidiary Wind River to private equity outfit TPG.

Wind River President, Jim Douglas, and his existing executive management team will lead the newly independent Wind River after the transaction closes.

“Our technology team is focused on backing strong, market-leading companies in growing industries,” said Nehal Raj, Partner and Head of Technology investing at TPG. “We see a tremendous market opportunity in industrial software driven by the convergence of the Internet of Things (IoT), intelligent devices and edge computing. As a market leader with a strong product portfolio, Wind River is well positioned to benefit from these trends. We are excited about the prospects for Wind River as an independent company, and plan to build on its strong foundation with investments in both organic and inorganic growth.”

For nearly 40 years, Wind River has helped the world’s technology leaders power generation after generation of the safest, most secure devices in the world. The company’s software runs the computing systems of the most important modern infrastructure, including manufacturing plants, medical devices, aircraft, railway, automobiles, and communications networks. Wind River’s products and solutions enable engineers, developers, manufacturers, and system integrators to build intelligent connected devices, sensors, gateways, and networks that unlock machine data and connect it to cloud and IT environments.

“This acquisition will establish Wind River as a leading independent software provider uniquely positioned to advance digital transformation within critical infrastructure segments with our comprehensive edge to cloud portfolio,” said Jim Douglas, Wind River President. “At the same time, TPG will provide Wind River with the flexibility and financial resources to fuel our many growth opportunities as a standalone software company that enables the deployment of safe, secure, and reliable intelligent systems.”

“This move is designed to sharpen our focus on growth opportuniti that align to Intel’s data-centric strategy,” said Tom Lantzsch, senior vice president and general manager of the Internet of Things Group at Intel. “Wind River will remain an important ecosystem partner, and we will continue to collaborate on critical software-defined infrastructure opportunities to advance an autonomous future. We expect this transition will be seamless for our mutual customers and partners.”

Link: http://www.tenco-tech.com/news/IC/electronic-component-28.html

Source from: Electronics weekly

Samsung commits to AI R&D in France

Young Sohn, former CEO of Inphi, now Chief Strategy Officer at Samsung, pitches a proposal to the President of France, Emmanuel Macron, at the Elysee Palace.

Young Sohn, former CEO of Inphi, now Chief Strategy Officer at Samsung, pitches a proposal to the President of France, Emmanuel Macron, at the Elysee Palace.

Sohn is reported to have undertaken to make France Samsung’s third main location for AI R&D after Korea and California.

Sohn is said to have undertaken to base 100 AI researchers in France.

Samsung’s French AI R&D effort will be headed up by Luc Julia, a Frenchman, who invented Apple’s Siri.

Link: http://www.tenco-tech.com/news/IC/electronic-component-27.html

Source from: electronics weekly

Ultrahaptics launches STRATOS development kit

Ultrahaptics, the haptic touch specialist, has  launched STRATOS Explore, the first development kit based on its new STRATOS platform. STRATOS Explore is available to buy through Ultrahaptics’ worldwide distribution network.

Ultrahaptics’ core mid-air haptic technology creates the sense of touch in mid-air by using arrays of ultrasonic transducers to project haptic feedback directly onto users’ hands.

STRATOS Explore has been created for developers who want to build applications requiring sophisticated mid-air haptic sensations, such as virtual reality, 3D gesture interfaces and advanced automotive controls.

The STRATOS platform’s faster refresh rate and precision control of ultrasound waves creates the ability to render complex shapes such as 3D objects.

Ultrahaptics’ technology controls the emission of ultrasound waves and manipulates them so that the combined pressure of the waves interacting produces enough force to be felt on a user’s skin.

When multiple pressure points are created, the user can feel 3D shapes, buttons, sliders and virtual objects in thin air.

The company has publicly demonstrated its technology in applications including augmented and virtual reality, digital signage and location-based entertainment, often in collaboration with worldwide brands such as Dell, Nike, Meta and Pagani.

It has also licensed its technology to third parties: BOSCH and Harman have used mid-air haptics to create concept vehicle interfaces that have been showcased around the world.

VP Sales, David Hearne, commented on the launch of the development kit, saying, “The STRATOS Explore development kit is the best solution for customers who want to explore how mid-air haptics can enhance their products. We can now offer an off-the-shelf development kit based on our most advanced platform. Whether customers are looking to create cutting-edge, cleaner and safer user interfaces, or to design immersive experiences in which users can reach out and touch 3D digital media, we now have the perfect tool for them to start innovating with.”

The STRATOS Explore development kit is available to buy from Ultrahaptics’ worldwide distribution network.

Link: http://www.tenco-tech.com/news/IC/electronic-component-26.html

Source from: electronics weekly