6pin photo-relay offers 5A and 20mΩ at 30V

Toshiba’s DIP4 and DIP6 high-current photo-relays can now switch up to 5A – claimed to be industry’s highest rating in a DIP6 package. Other versions can handle 200V.

With the internal mosfets fabricated in the firm’s U-MOS VIII process, there are five new devices – TLP3543A, TLP3545A, TLP3546A, TLP3556A and TLP3558A.

Together they offer options with Voff ranging from 30V to 200V and Ion from 5.0A to 0.7A.

All offer ac or dc switching, but only 6pin versions offer the dc-only ‘C-connection’ where both internal mosfets can be connected in parallel to halve on-resistance  – to as low as 20mΩ in the case of the TLP3543A 30V version.

To add a design safety margin, pulse capability can be up to 3x the steady-state current.

Off leakage (Ioff) max is 1μA.

“These photo-relays can replace 1-Form-A mechanical relays in various DC and AC applications, contributing to improved system reliability and reducing the space needed for relays and relay drivers,” said Toshiba. “They deliver a rated operating temperature of 110°C max, making it easier to accommodate temperature margins in system designs.”

Applications in factory automation and other industrial uses are expected, in equipment, building automation, HVAC, semiconductor testing, ATE and security.

Link: http://www.tenco-tech.com/news/IC/electronic-component-25.html

Source from: Electronics weekly

BSI offers UK IoT security stamp of approval

The British Standards Institution has launched a compliance scheme and governance framework for IoT devices and applications, allowing them to be assessed against the UK Government’s proposed IoT code of practice – a code of practice that was announced earlier this month by the Minister for digital and the creative industries.

Its IoT compliance scheme, claims BSI, is based on global best practice for information security, and is matched to the 13 points in the IoT proposed code of practice developed by the Department for Digital, Culture, Media and Sport (DCMS), in collaboration with the National Cyber Security Centre, manufacturers and retailers.

“Consumers and industry need to have confidence in the safety and reliability of these new devices and applications. Standards catalyse trust between innovative technologies and innovative business models. Independent verification to a government code of practice will unlock trust in IoT both today and tomorrow,” said BSI IoT development director David Mudd.

The Institution has already developed standards and guides to digital communication, pointing out that automatic IoT resource discovery specification PAS 212 came from BSI.

“BSI has a 1,300 strong IoT community of experts and organisations shaping new opportunities and creating industry-led best practice in IoT,” it said. “As technologies and business models evolve, consensus standards are developed and revised, allowing the next cycle of innovation to start from a higher level.”

Link: http://www.tenco-tech.com/news/IC/electronic-component-24.html

Source from: Electronics weekly

350W ac-dc PSUs for industry and healthcare

XP Power today announced the launch of series of rugged 350W AC-DC chassis-mount PSUs, intended for industrial, technology and healthcare applications.

SMP350 supplies have a built-in cooling fan, screw terminal connections, low (class-B) EMI emissions, and come in a 92 x 178 x 43mm enclosure – equating to 13W/in3.

The series has a 85 to 264Vac input voltage range for use worldwide and offers different models with 12, 15, 18, 24, 28, 36 or 48Vdc outputs.

Operation is over -40 to +70°C, with full power available up to +50°C.

Features include remote on/off capability and high efficiency (93% max), as well as input to output isolation of 4kV with a 2 x MOPP rating.

No load power is 2.6W from 230Vac when inhibited, or 1.25W at 115Vac.

Applications might include process control, broadcast, instrumentation, energy sector and utilities sector. For medical use there is a version with earth leakage below 300μA.

SMP350 is available from Digi-Key, element14, Farnell, RS Components, approved regional distributors, or direct from XP Power, and comes with a three year warranty.

Link: http://www.tenco-tech.com/news/IC/electronic-component-23.html

Source from: Electronics weekly

Samsung to ramp 10nm AP in H2

Samsung says it will begin volume production of a 10nm Exynos AP in H2.

The chip has four Cortex-A73 cores clocked at 2.3GHz and four ARM Cortex-A53 cores running at 1.6GHz, and a second-generation Bifrost-based ARM Mali-G72 GPzu.

An embedded Cortex-M4F-based low-power sensor hub manages the sensors in real-time without waking the main processor.

The LTE modem supports Cat.12 3CA at 600Mbps for downlink and Cat.13 2CA at 150Mbps for uplink.

Dubbed 9610, the processor has 802.11ac 2×2 MIMO Wi-Fi, Bluetooth 5.0, and a 4-mode GNSS receiver that includes GPS, GLONASS, BeiDou and Galileo.

Link: http://www.tenco-tech.com/news/IC/electronic-component-22.html

Source from: electronics weekly

500W 12 to 24V converter for tough environments

Gresham Power Electronics has introduced a 500W dc-dc converter for military and non-tactical vehicle mounted communications and security systems.

Called GPD500 is now available from the Salisbury-based power supply maker, which accepts inputs between 10 to 20Vdc and delivers regulated 24Vdc output, designed to meet the requirements of MIL-STD 1275D.

“Sophisticated electronics developed for military vehicles, is designed to be powered from 24/28Vdc and in most cases is unable to operate from the 12Vdc electrical systems found on non-tactical vehicles,” said Gresham. “Instead of making significant changes to the equipment design, this issue is solved by the GPD500.”

Efficiency is typically 96% at full load and operation is over ambients from -40 to 70°C.

The IP67 epoxy-sealed enclosure is 149 x 27 x 119mm, weighs 750g and meets MIL-STD-1275A.

Built-in thermal sensing provides over-temperature shut-down with automatic recovery, and other protections include: reverse input, current limit, short-circuit, input under-voltage shut down and input over-voltage protection.

Several units can be paralleled for more power.

Other foreseen applications include recreational vehicles, marine and other rugged environments, mobile broadcast, cellular base-station power, industrial controls, emergency back-up and solar power systems.

Link: http://www.tenco-tech.com/news/IC/electronic-component-21.html

Source: electronics weekly

EU fines capacitor cartel

The EU has fined seven companies a collective €254 million for running a capacitor cartel.

The seven are: Nippon Chemi-Con Corp, Hitachi Chemical, Nichicon, Rubycon, Elna, Tokin and Matsuo Electric.

An eighth member of the cartel, Sanyo Electric, was not fined because it acted as whistleblower reporting the cartel’s wrongdoings to the EU.

The EU found that, between  1998 and 2012, the companies “participated in multilateral meetings and engaged in bilateral or trilateral contacts to exchange commercially sensitive information”.

They exchanged information on future prices and pricing intentions, and on future supply and demand information.

They agreed prices between eachother and monitored that they were adhered to.

Emails between them showed that they knew that what they are doing it was illegal.

Link: http://www.tenco-tech.com/news/IC/electronic-component-20.html

Source from: electronics weekly

US firm patents flexible organic thin-film for smartphone displays

A US-based thin-film technology developer says it has been granted a US patent for technology invented by Ashok Chaudhari and based on the work of the late Dr. Praveen Chaudhari, winner of the 1995 US Medal of Technology.

The company Solar-Tectic LLC has developed the hybrid organic/inorganic thin-film which can be grown on inexpensive substrates, such as flexible and ordinary soda-lime glass.

It has applications in various industries such as solar, displays and OLEDs.

US patent (14/571,800) titled “Hybrid organic/inorganic eutectic solar cell” discloses a growth technique that “for the first time allows for low temperature deposition of exceptionally high quality polymer/inorganic semiconductor films from a variety of materials such as silicon, and germanium on inexpensive substrates, solving an intractable problem”.

According to Solar-Tectic LLC, the thin-film growth process is “very well suited for large-scale industrial applications using common deposition processes, such as e-beam, CVD, etc.”

New York-based Solar-Tectic also plans grow thin layers of sapphire (crystalline Al2O3) on ordinary soda-lime glass or other kinds of glasses.  This can be used as a substrate for deposition of single crystalline silicon for PV purposes, as well as for display applications like covers for smartphones.

Link: http://www.tenco-tech.com/news/IC/electronic-component-19.html

Source from: electronics weekly

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Small Robot Company brings Rachael to Hong Kong

Small Robot Company of Shropshire, the agri-tech start-up, will showcase its prototype Rachael robot at the GREAT Festival of Innovation in Hong Kong.

Rachael has all the core technology needed for the company’s  forthcoming Tom, Dick and Harry arable farmbots.

This includes autonomy, geolocation, obstacle avoidance, navigation and the ability to accurately position objects on a map within 2 centimetres.

In addition Small Robot Company will preview the design for its ‘Harry’ robot, a digital planting robot for arable crops. Harry will accurately place seed individually in the ground at a uniform depth to within 2cm accuracy.

This will create a plant level map showing the location of each seed, enabling farming to be digitised. Harry’s commercial trial is anticipated for October 2018.

“Small Robot Company is both proud to represent Great Britain, and excited to explore how we can provide an arable crop service that brings benefit across the world. Rice remains the single most important food crop globally. But labour shortages, chemical overuse and improving yield are all ongoing difficulties,” said Ben Scott-Robinson, co-founder, Small Robot Company.

“Robotics has the potential to solve these problems. We want to use this opportunity to starting working with rice farmers to evolve and develop a service that answers their needs, in the same way we have been working with wheat farmers in the UK. Being able to provide precision and automation for rice would not just be a step forward in farming, it will revolutionise agriculture for half the world’s population.”

The first crop that Small Robot Company will focus on is wheat, with its service later to be extended to other arable crops such as rice and soya.

“There are several challenges with rice production that we hope to help solve. Firstly, labour. Urban migration is causing shortages and the age of the average rice farmer is steadily rising; many are near retirement,” continues Ben. “Secondly, the environment. Overuse of chemicals is endemic. And fertiliser usage is 75% higher and pesticide 40% in China than the global average for rice production. Thirdly, yield. Growing world population means a 25% leap in rice yield is required by the year 2025. Meanwhile crop diversification, industrialisation and urbanisation have caused a 19% reduction in the land area farmed for rice in the last 40 years.”

Link: http://www.tenco-tech.com/news/IC/electronic-component-18.html

Source from:electronics weekly

Low-noise LDOs for Hi-Fi circuits up to 1A

Rohm has introduced ‘high-fidelity’ power supply ICs aimed at audio devices requiring high-resolution audio play-back.

Above the quality of CD audio, it sees high-resolution audio sources typically playing back at “greater than 96kHz and 24bit”.

Called the BD372xx series, the regulators have a newly-developed fast error amp circuit and low-noise architecture.

“Multiple parameters that were shown to affect audio quality in the development and manufacturing processes were optimised via real-world listening tests, resulting in industry-leading performance in voltage stability, noise level, and power supply symmetry,” claimed the firm. “The result is a very clean power supply compared with conventional solutions, making it possible to achieve higher audio quality, including improved sound imaging and resolution.”

There are three versions:

BD37201NUX produces 1.0-4.5V at 500mA from 2.7-5.5V

BD37210MUV: 1-15V at 1A from 3.0-16V

BD37215MUV: -1 to -15V at 1A from -3 to 16V

In each case, noise across 10Hz to 100kHz is under 6uVrms – see table for other parameters.

“BD37201NUX is ideal for low-voltage digital devices such as DACs and DSPs, while the positive BD37210MUV and negative BD37215MUV are optimised for analogue devices like sound processors and current-voltage conversion amps that operate using both positive and negative voltage supplies,” said Rohm.

Typical stand-by current is 5.8μA for the BD37210MUV.

Applications are foreseen in Hi-Fi audio systems, headphone amplifiers, portables, home audio and wireless speakers.

Link: http://www.tenco-tech.com

Source from:Electronics weekly

ST ToF sensor extends FlightSense detection range to 4m

FlightSense sensors directly measure distance to the object based on the time for emitted photons to be reflected, enabling accurate distance-ranging regardless of the object’s surface characteristics.

Thev VL53L1X is suitable for mobile robotics for wall following, cliff detection, collision avoidance and hover/landing assistance for drones or unmanned aerial vehicles (UAVs).

The power-saving presence-detection mode enables  auto-sleep/wake-on-approach use cases for PCs, notebooks and IoT devices, in addition to camera auto-focus assist, and gesture recognition.

Further applications include washroom automation in toilets, faucets or soap dispensers, and package counting to aid inventory management in vending machines or smart-shelf systems.

The VL53L1X measures 4.9mm x 2.5mm x 1.56mm. It is pin-compatible with its predecessor, the VL53L0X.

The package contains the laser driver and emitter as well as the Single-Photon Avalanche Diode (SPAD) light receiver.

Furthermore, the 940nm emitter, operating in the non-visible spectrum, eliminates distracting light emission and can be hidden behind a protective window without impairing measurement performance.

Link: http://www.tenco-tech.com

Source from: electronics weekly

Comment: US and China lead Europe in the 5G race

The message from Mobile World Congress last month was that 5G development cycles for chipset, terminal and infrastructure firms are accelerating with first network launches perhaps just months away.

According to networks supplier Nokia, commercial 5G roll‑outs may start later this year in the US and China.

South Korea and Japan are not expected to be far behind.

Nokia will supply 5G network infrastructure to T-Mobile for the operator’s planned nationwide 5G multi-band network in the US.

Chinese networks giant Huawei also sees a ramping up of 5G network development globally and it says it is involved in pre-commercial development with 30‑plus network operators.

Despite early 5G trials in the UK and Germany, Europe seems to be a little behind the US and China in the 5G race.

But operators and suppliers believe there is still time to catch up.

According to a report from Rethink Technology Research, fragmented regulation and the need for greater urgency from the main mobile operators mean Europe may be not prepared for important 5G-enabled applications such as the industrial internet of things (IIoT) and smart cities.

“One reason Europe is falling behind,” said Caroline Gabriel, Rethink’s research director, “is that regulations and processes surrounding sites, power levels and equipment approvals have for some time been too rigid, lengthy and fragmented to encourage mass‑scale roll-out.”

The answer could be for regulators to enable more flexible small cell network deployments, then “Europe could catch up quickly in 5G use cases which require dense networks,” she said.

Huawei is active in the UK and has 5G partnerships with BT and mobile operator EE.

The companies are conducting live trials of 5G wireless links using the proposed millimetre wave radio interface standard known as New Radio (NR).

Agreed by the 3GPP standards committee, the NR access standard is seen as an important 5G technical hurdle to be cleared.

Approaches to network slicing are also heading in the right direction.

In the UK, communications infrastructure company Arqiva is working with Samsung on what they claim is the first field trial of 5G fixed wireless access technology in the UK and Europe, and is operating in the 28GHz millimetre wave spectrum.

According to Simon Beresford-Wylie, CEO of Arqiva the trial, “though only a proof of concept at this stage, [has] seen a great level of response so far from our entire customer base”.

Inevitably development of 5G mobile devices is a little behind the network plans, but there are also signs that it is accelerating.

Huawei unveiled its first 5G chipsets in Barcelona and is rumoured to have plans to launch a 5G smartphone later this year.

Handset giant Samsung is not expected to be quiet about its 5G plans for much longer.

It has already demonstrated a tablet with 5G transmission capabilities in the US.

Source from: Electronics Weekly

Link: http://www.tenco-tech.com/news/IC/electronic-component-15.html

IC Insights’ 2018 memory forecasts adjusted upwards

The DRAM and NAND flash memory market growth forecasts for 2018 have been adjusted upward, by IC Insights,  to 37% for DRAM and 17% for NAND flash.

The big increase in the DRAM market forecast for 2018 is primarily due to a much stronger ASP expected for this year than was originally forecast.

IC Insights now forecasts that the DRAM ASP will register a 36% jump in 2018 as compared to 2017, when the DRAM ASP surged by an amazing 81%.

Moreover, the NAND flash ASP is forecast to increase 10% this year, after jumping by 45% in 2017.

In contrast to strong DRAM and NAND flash ASP increases, 2018 unit volume growth for these product segments is expected to be up only 1% and 6%, respectively.

​

At $99.6 billion, the DRAM market is forecast to be by far the largest single product category in the IC industry in 2018, exceeding the expected NAND flash market ($62.1 billion) by $37.5 billion.

Figure 1 shows that the DRAM market has provided a significant tailwind or headwind for total worldwide IC market growth in four out of the last five years.

The DRAM market dropped by 8% in 2016, spurred by a 12% decline in ASP, and the DRAM segment became a headwind to worldwide IC market growth that year instead of the tailwind it had been in 2013 and 2014.

As shown, the DRAM market shaved two percentage points off of total IC industry growth in 2016. In contrast, the DRAM segment boosted total IC market growth last year by nine percentage points.

For 2018, the expected five point positive impact of the DRAM market on total IC market growth is forecast to be much less significant than it was in 2017.

Source from: Electronics weekly

Link: http://www.tenco-tech.com/news/IC/electronic-component-14.html

Glasgow Uni makes bendy chips

A new method of creating bendable silicon chips could help pave the way for a new generation of high-performance flexible electronic devices, say Glasgow University researchers.

The researchers have described how they scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems in the future, and discuss the barriers which will need to be overcome in order to make those systems commonplace.

They  show how they have been able to make an ultrathin silicon wafer capable of delivering high-performance computing while remaining flexible.

Flexible electronics have many potential applications, including implantable electronics, bendable displays, wearable technology which can provide constant feedback on users’ health. The BEST group has already made significant progress in wearable technology, including a flexible sensor and accompanying smartphone app which can provide feedback on the pH levels of users’ sweat.

“Silicon is a brittle material which breaks easily under stress, which has made it very difficult to use in bendable systems on anything other than the nano-scale,” says Professor Ravinder Dahiya who led the group, “what we’ve been able to do for the first time is adapt existing processes to transfer wafer-scale ultrathin silicon chips onto flexible substrates. The process has been demonstrated with wafers four inches in diameter, but it can be implemented for larger wafers as well. In any case, this scale is sufficient for manufacturing ultra-thin silicon wafers capable of delivering satisfactory computing power.”

The team’s paper outlines the techniques they have developed to transfer several different types of ultra-thin silicon chips of around 15 microns in thickness onto flexible substrates – a human blood cell, for comparison, is about five microns in width.

Source from: electronics weekly

Link: http://www.tenco-tech.com/news/IC/electronic-component-13.html

Raspberry Pi 3 gets faster, better Wi-Fi, and PoE-ready

What has allowed the extra speed, according to Farnell, which has stock and is ready to ship the new board, is new flip-chip packaging for the main processor which, amongst other things eases heat dissipation (see photo). “There is a heat spreader on top so it runs cooler,” Farnell head of single-board computers Peter Wenzel told Electronics Weekly.

Other changes include a move to a Cypress Wi-Fi chipset, which has allowed Pi to go dual-band, now operating at both 2.4 and 5GHz.

This Wi-Fi implementation has been shielded so that near-by boards will not change its operating characteristics significantly, allowing it to be pre-certified. “When it is used for professional applications, it will not have to be re-certified,” said Wenzel.

Bluetooth remains the same – version 4.2 – but the Ethernet system is also uprated, nominally to Gbit Ethernet, but limited to 300Mbit/s because it is driven via USB 2 on-board. This is still 3x faster than the original Raspberry Pi 3.

A related change on the Ethernet interface is that this is the first Raspberry Pi that can be powered via its RJ45 Ethernet cable socket using power-over-Ethernet (PoE).

Support is not quite native, as the connections are there but a Raspberry Pi-branded ‘HAT’ (add-on board) will be required to handle power conversion and other aspects of PoE. Farnell will be stocking this when it arrives in the summer, said Wenzel.

Booting over Ethernet has also been enabled, without a micro SD Card installed in the board.

According to Wenzel, all the changes are intended to improve the computer for professional use, the result in Farnell’s case of customer feedback through focus groups and a customer survey.

It has, for example, seen Raspberry Pi used in controllers for pre-paid TV sets in hospitals, in advertising screens in cinemas, and in lift monitoring systems for smart buildings.

One requested feature customers are not going to get is on-board eMMC flash – wanted to avoid using a micro SD card in the board’s socket, according to Wenzel. Instead, the boot-over-Ethernet facility has been provided.

“The launch of the Raspberry Pi 3 Model B+ is about providing industry with a board that is perfectly suited for use in embedded products,” said Eben Upton, CEO or Raspberry Pi Trading.

Raspberry Pi Trading. “Raspberry Pi has already proven itself to have stability, quality and ease-of-use combined with an attractive price point.

The board retains the same mechanical footprint and pin out as both the Raspberry Pi 2 Model B and Raspberry Pi 3 Model B. It will also work from the same power supply.

As has been the case throughout Raspberry Pi’s existence, RS Components will also be supplying the Model B+.

Source from: electronics weekly

link: http://www.tenco-tech.com/news/IC/electronic-component-11.html

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